Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-12-20
2005-12-20
Trinh, Michael (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S685000, C257S686000, C257S688000, C257S689000, C257S723000, C257S730000, C257S773000, C257S776000, C257S778000
Reexamination Certificate
active
06977441
ABSTRACT:
An interconnect substrate including a first substrate on which a first interconnect pattern is formed, having a mounting region for an electronic chip; and a second substrate on which a second interconnect pattern electrically connected to the first interconnect pattern is formed. The second substrate includes a region to which at least a part of the first substrate is adhered, and a mounting region for an electronic chip.
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Soward Ida M.
Trinh Michael
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