Interconnect substrate and method of manufacture thereof,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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Details

C257S685000, C257S686000, C257S688000, C257S689000, C257S723000, C257S730000, C257S773000, C257S776000, C257S778000

Reexamination Certificate

active

06977441

ABSTRACT:
An interconnect substrate including a first substrate on which a first interconnect pattern is formed, having a mounting region for an electronic chip; and a second substrate on which a second interconnect pattern electrically connected to the first interconnect pattern is formed. The second substrate includes a region to which at least a part of the first substrate is adhered, and a mounting region for an electronic chip.

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