Inkjet device encapsulated at the wafer scale

Details Inkjet device encapsulated at the wafer scale Inkjet device encapsulated at the wafer scale

2005-08-02

2005-08-02

Meier, Stephen D. (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S020000

Reexamination Certificate

active

06923524

ABSTRACT:
Micro-fabricated devices (152) is packaged at the wafer (150) stage with a cap (156, 160) applied to one or both sides of the wafer (150) prior to separation of the wafer into separate devices. The cap (156) on the top side overlays the respective device(s) (152), except the bond pads (158). The cap (160) on the bottom overlays all of the respective device(s) (152).

REFERENCES:
patent: 5686698 (1997-11-01), Mahadevan et al.
patent: 5824177 (1998-10-01), Yoshihara et al.
patent: 6255741 (2001-07-01), Yoshihara et al.
patent: 6557978 (2003-05-01), Silverbrook
patent: 11017043 (1999-01-01), None

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