Semiconductor connection substrate

Details Semiconductor connection substrate Semiconductor connection substrate

Filed on

2005-08-23

Date issued

2005-08-23

Examiner

Quach, T. N. (Department: 2826)

Patent Class

Active solid-state devices (e.g., transistors, solid-state diode

SubClass

Housing or package

SubSubClass

With contact or lead

Other Related Categories

C257S724000, C257S738000, C257S774000

Type

Reexamination Certificate

Status

active

Patent number

06933601

Description

ABSTRACT:
A semiconductor connection substrate which connects a semiconductor element to a mounting substrate such as a printed substrate comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.

REFERENCES:
patent: 5313361 (1994-05-01), Martin
patent: 5628852 (1997-05-01), Ishida
patent: 5866942 (1999-02-01), Suzuki et al.
patent: 6028364 (2000-02-01), Ogino et al.
patent: 6617681 (2003-09-01), Bohr
patent: 08-255981 (1996-10-01), None
patent: 09-321166 (1997-12-01), None
patent: 09-321184 (1997-12-01), None
patent: 10-284694 (1998-10-01), None
patent: 2000-124358 (2000-04-01), None
patent: 2001-177008 (2001-06-01), None
International Search Report PCT/JP02/07091.

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