Plastic and nonmetallic article shaping or treating: processes – With measuring – testing – or inspecting
Patent
1989-10-06
1993-03-16
Derrington, James
Plastic and nonmetallic article shaping or treating: processes
With measuring, testing, or inspecting
156189, 264 60, 264 61, 174255, C04B 3564
Patent
active
051941961
ABSTRACT:
A hermetic package for an electronic device is manufactured by providing a green glass ceramic body with a green via to produce a workpiece. The workpiece is sintered at a temperature at or above 500.degree. C., while compressing the workpiece at a pressure at or above 100 pounds per square inch, so as to obtain a hermetic package. The green via comprises a mixture of copper and a glass ceramic material with a sufficient volume of glass to produce a hermetic package, yet with sufficient copper to have a suitable electrical conductivity.
The hermetic package thus produced comprises a sintered glass ceramic body having an electrically conductive sintered via which is hermetically bonded to the glass ceramic body and which comprises a mixture of an electrically conductive material and a glass ceramic material. The electrically conductive material forms at most 50 volume percent of the via.
The workpiece may be sintered in a sintering fixture having a frame and a compensating insert. The compensating insert and frame bound a sintering chamber for accommodating the workpiece. By providing a frame having a thermal expansion coefficient greater than that of the workpiece, and by providing a compensating insert having a thermal expansion coefficient greater than that of the frame, a close fit can be assured between the workpiece and the sintering fixture over a large range of temperatures.
REFERENCES:
patent: 3436451 (1969-04-01), Wasser
patent: 3963449 (1976-06-01), Seki et al.
patent: 3992160 (1976-11-01), Marzocchi et al.
patent: 4009238 (1977-02-01), Niedermeier et al.
patent: 4110084 (1978-08-01), Lee et al.
patent: 4234367 (1980-11-01), Herron et al.
patent: 4301324 (1981-11-01), Kumar et al.
patent: 4340436 (1982-07-01), Dubetsky et al.
patent: 4381931 (1983-05-01), Hunold et al.
patent: 4499049 (1985-02-01), Hanejko
patent: 4524138 (1985-06-01), Schwetz et al.
patent: 4612689 (1986-09-01), de Wild et al.
patent: 4640711 (1987-02-01), Lichti et al.
patent: 4879156 (1989-11-01), Herron et al.
IBM Technical Disclosure Bulletin, vol. 23, No. 5, Oct. 1980, pp. 1885-1886.
Bordia, R. K., et al., "Sintering Behavior of Ceramic Films Constrained by a Rigid Substrate," Journal of the American Ceramic Society, vol. 68, No. 6, pp. 287-292 (Jun. 1985).
Giess, E., et al. "Isothermal Sintering of Cordierite-Type Glass Powders." Journal of the American Ceramic Society, vol. 67, No. 8, pp. 549-552 (Aug. 1984).
Murray, P., et al. "Practical and Theoretical Aspects of the Hot Pressing of Refractory Oxides." Trans. Brit. Ceram. Soc. vol. 53, pp. 474-510 (1954).
Roller, M. B. "Characterization of the Time-Temperature-Viscosity Behavior of Curling B-Staged Epoxy Resin." Polymer Engineering and Science, vol. 15, No. 6, pp. 406-414 (Jun. 1975).
Tong, H. M., et al. "Prediction of Thermoset Viscosity Using a Thermomechanical Analyzer." Journal of Applied Polymer Science, vol. 31, pp. 2509-2522 (1986).
Venkatachari, K. R., et al. "Shear Deformation and Densification of Powder Compacts." Journal of the American Ceramic Society, vol. 69, No. 6, pp. 499-506 (Jun. 1986).
Chance Dudley A.
Goland David B.
Tong Ho-Ming
Blecker Ira David
Derrington James
International Business Machines - Corporation
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