Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2005-12-13
2005-12-13
Elms, Richard (Department: 2824)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S758000, C257S759000, C257S760000, C257S774000
Reexamination Certificate
active
06975033
ABSTRACT:
A semiconductor device includes a semiconductor substrate on which an element is formed, a low dielectric constant insulation film formed over the semiconductor substrate and having a relative dielectric constant of 3 or lower, a plug and a wiring layer buried in the low dielectric constant insulation film, and a high Young's modulus insulation film having a Young's modulus of 15 GPa or higher and formed in contact with a side of the plug between the low dielectric constant insulation film and the plug.
REFERENCES:
patent: 5236869 (1993-08-01), Takagi et al.
patent: 5942799 (1999-08-01), Danek et al.
patent: 6130156 (2000-10-01), Havemann et al.
patent: 6229211 (2001-05-01), Kawanoue et al.
patent: 6348402 (2002-02-01), Kawanoue et al.
patent: 6559548 (2003-05-01), Matsunaga et al.
patent: 9-306988 (1997-11-01), None
patent: 9-312291 (1997-12-01), None
patent: 10-284600 (1998-10-01), None
patent: 11-54621 (1999-02-01), None
patent: 11-340330 (1999-12-01), None
patent: 2000-49116 (2000-02-01), None
patent: 2000-106397 (2000-04-01), None
patent: 2000-260770 (2000-09-01), None
patent: 2000-269213 (2000-09-01), None
patent: 2000-294634 (2000-10-01), None
patent: 2001-35917 (2001-02-01), None
patent: 2003-520448 (2003-07-01), None
Kirchner et al.; “Ultra Thin Sacrificial Diffusion Barriers—Control of Diffusion Across the Cu-SiO2Interface”; Mat. Res. Soc. Symp. Proc. vol. 318, pp. 319-322, (1994).
Korean Patent Office Action dated Dec. 13, 2004, issued in counterpart application KR 10-2002-0083208.
Chinese Patent Office Action dated Dec. 3, 2004, issued in counterpart application CN 021568146.
Hasunuma Masahiko
Ito Sachiyo
Kawanoue Takashi
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Menz Douglas
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