Method of forming wiring, and method of arranging devices...

Details Method of forming wiring, and method of arranging devices... Method of forming wiring, and method of arranging devices...

2005-08-23

2005-08-23

Lee, Hsien-ming (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S458000, C438S795000, C438S022000, C438S025000

Reexamination Certificate

active

06933208

ABSTRACT:
A method for forming via holes includes placing an insulating layer on a first wiring layer, forming opening portions in the insulating layer, and forming a second wiring layer on the insulating layer. At the time of forming the opening portions, the insulating layer is irradiated with a laser beam with the focus position staggered.

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patent: 11-346045 (1999-12-01), None
patent: WO 96/05477 (1996-02-01), None

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