Method of packaging an optical sensor

Details Method of packaging an optical sensor Method of packaging an optical sensor

2005-06-14

2005-06-14

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S666000, C257S678000, C257S680000

Reexamination Certificate

active

06905910

ABSTRACT:
An image sensor device includes a first, QFN type leadframe to which a sensor IC is electrically connected. A second leadframe is provided for holding a lens. A third leadframe is positioned between the first and second leadframes to appropriately space the IC from the lens. Multiple sensor devices are assembled at the same time by the use of leadframe panels.

REFERENCES:
patent: 5950074 (1999-09-01), Glenn et al.
patent: 6034429 (2000-03-01), Glenn et al.
patent: 6117705 (2000-09-01), Glenn et al.
patent: 6121675 (2000-09-01), Fukamura et al.
patent: 6143588 (2000-11-01), Glenn
patent: 6266197 (2001-07-01), Glenn
patent: 6268231 (2001-07-01), Wetzel
patent: 6268654 (2001-07-01), Glenn et al.
patent: 6274927 (2001-08-01), Glenn
patent: 6285064 (2001-09-01), Foster
patent: 6342406 (2002-01-01), Glenn et al.
patent: 6384472 (2002-05-01), Huang
patent: 6395582 (2002-05-01), Sohn et al.
patent: 6410981 (2002-06-01), Tao
patent: 6410987 (2002-06-01), Kanemoto et al.
patent: 6822326 (2004-11-01), Enquist et al.
patent: 2001/0014486 (2001-08-01), Glenn
patent: 2002/0110951 (2002-08-01), Wang et al.
patent: 2004/0188699 (2004-09-01), Kameyama et al.
patent: WO 01/15237 (2001-03-01), None

Affiliated with

Also associated with

Rating

Method of packaging an optical sensor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of packaging an optical sensor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of packaging an optical sensor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3494681