Process for encapsulating a component made of organic...

Electric lamp and discharge devices – With luminescent solid or liquid material – Solid-state type

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C219S085130, C219S121640

Reexamination Certificate

active

06936963

ABSTRACT:
A process for encapsulating a component made of organic semiconductors is provided which includes steps of: a) providing a housing including a substrate with electrical connections and a cover; b) mixing a soldering glass with at least one of a binder and a solvent; c) applying the soldering glass at least to the cover, in the form of an encircling bank; d) expelling the binder or solvent; e) sintering-on of the solder; f) covering the substrate with layers which represent the semiconductor component together with electrodes; g) placing the cover onto the substrate; and h) locally heating the soldering glass by means of a light source with a predetermined peak wavelength, wherein the housing parts and soldering glass are matched to one another such that their coefficients of thermal expansion differ from one another by less than 1.0×10−6K−1.

REFERENCES:
patent: 4346963 (1982-08-01), Kobale et al.
patent: 4354717 (1982-10-01), Rech et al.
patent: 4883777 (1989-11-01), Yamanaka
patent: 6111357 (2000-08-01), Fleming et al.
patent: 6160346 (2000-12-01), Vleggaar et al.
patent: 6195142 (2001-02-01), Gyotoku et al.
patent: 2926331 (1981-01-01), None
patent: 38 37 300 (1990-05-01), None
patent: 197 27 913 (1999-01-01), None
patent: 198 33 252 (2000-02-01), None
patent: 198 45 075 (2000-04-01), None
patent: 198 57 550 (2000-06-01), None
patent: 100 05 296 (2001-08-01), None
patent: 10027989 (2001-12-01), None
patent: 1209869 (1970-10-01), None
patent: 60-234768 (1985-11-01), None
patent: 4-214045 (1992-08-01), None
patent: 2001-319775 (2001-11-01), None
patent: WO 98/53644 (1998-11-01), None
patent: WO 00/12256 (2000-03-01), None
patent: WO 01/18886 (2001-03-01), None
patent: WO 01/18887 (2001-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for encapsulating a component made of organic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for encapsulating a component made of organic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for encapsulating a component made of organic... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3494094

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.