Chip size image sensor camera module

Details Chip size image sensor camera module Chip size image sensor camera module

2005-12-27

2005-12-27

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S432000, C257S433000

Reexamination Certificate

active

06979902

ABSTRACT:
An image sensor camera module includes a dielectric flex tape and a semiconductor die including an imager array. Die attach pads are formed along one edge of the die. The dielectric flex tape overlaps either the top or the bottom of the die, and connections between the die and the tape are made using solder bumps or wire bonds, for example. No supporting substrate other than the tape is required. A lensing structure can be attached directly to the die.

REFERENCES:
patent: 6384397 (2002-05-01), Takiar et al.
patent: 6528778 (2003-03-01), Kimba et al.
patent: 6768516 (2004-07-01), Yamada et al.
patent: 2003/0201447 (2003-10-01), Yamazaki et al.
patent: 2003/0223008 (2003-12-01), Kim et al.
patent: 2004/0027477 (2004-02-01), Tamura et al.
patent: 2004/0188838 (2004-09-01), Okada et al.

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