Method of electroplating copper over a patterned dielectric...

Details Method of electroplating copper over a patterned dielectric... Method of electroplating copper over a patterned dielectric...

2005-10-25

2005-10-25

Schillinger, Laura M (Department: 2813)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Optical characteristic sensed

C438S633000

Reexamination Certificate

active

06958247

ABSTRACT:
In a new method of plating metal onto dielectric layers including small diameter vias and large diameter trenches, a surface roughness is created at least on non-patterned regions of the dielectric layer to enhance the uniformity of material removal in a subsequent chemical mechanical polishing (CMP) process.

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