Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-06-21
2005-06-21
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S107000, C438S110000, C438S113000
Reexamination Certificate
active
06908788
ABSTRACT:
A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip, a conductive trace and a metal base, wherein the chip includes a conductive pad, and the conductive trace is disposed between the metal base and the chip, then forming a through-hole that extends through the metal base and exposes the conductive trace and the pad, then forming a connection joint that contacts and electrically connects the conductive trace and the pad in the through-hole, and then etching the metal base, thereby reducing contact area between the metal base and another material. Preferably, the through-hole extends through an insulative adhesive that attaches the conductive trace to the chip, and etching the metal base reduces contact area between the metal base and the connection joint.
REFERENCES:
patent: 4442967 (1984-04-01), van de Pas et al.
patent: 4661192 (1987-04-01), McShane
patent: 4717066 (1988-01-01), Goldenberg et al.
patent: 4750666 (1988-06-01), Neugebauer et al.
patent: 4807021 (1989-02-01), Okumura
patent: 4925083 (1990-05-01), Farassat et al.
patent: 4937653 (1990-06-01), Blonder et al.
patent: 4955523 (1990-09-01), Calomagno et al.
patent: 4970571 (1990-11-01), Yamakawa et al.
patent: 4984358 (1991-01-01), Nelson
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5060843 (1991-10-01), Yasuzato et al.
patent: 5074947 (1991-12-01), Estes et al.
patent: 5090119 (1992-02-01), Tsuda et al.
patent: 5106461 (1992-04-01), Volfson et al.
patent: 5116463 (1992-05-01), Lin et al.
patent: 5137845 (1992-08-01), Lochon et al.
patent: 5167992 (1992-12-01), Lin et al.
patent: 5172851 (1992-12-01), Matsushita et al.
patent: 5196371 (1993-03-01), Kulesza et al.
patent: 5209817 (1993-05-01), Ahmad et al.
patent: 5237130 (1993-08-01), Kulesza et al.
patent: 5260234 (1993-11-01), Long
patent: 5261593 (1993-11-01), Casson et al.
patent: 5275330 (1994-01-01), Issacs et al.
patent: 5284796 (1994-02-01), Nakanishi et al.
patent: 5293067 (1994-03-01), Thompson et al.
patent: 5294038 (1994-03-01), Nakano et al.
patent: 5327010 (1994-07-01), Uenaka et al.
patent: 5334804 (1994-08-01), Love et al.
patent: 5346750 (1994-09-01), Hatakeyama et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5358621 (1994-10-01), Oyama
patent: 5364004 (1994-11-01), Davidson
patent: 5397921 (1995-03-01), Karnezos
patent: 5407864 (1995-04-01), Kim
patent: 5424245 (1995-06-01), Gurtler et al.
patent: 5438477 (1995-08-01), Pasch
patent: 5439162 (1995-08-01), George et al.
patent: 5447886 (1995-09-01), Rai
patent: 5454161 (1995-10-01), Beilin et al.
patent: 5454928 (1995-10-01), Rogers et al.
patent: 5475236 (1995-12-01), Yoshizaki
patent: 5477933 (1995-12-01), Nguyen
patent: 5478007 (1995-12-01), Marrs
patent: 5483421 (1996-01-01), Gedney et al.
patent: 5484647 (1996-01-01), Nakatani et al.
patent: 5485949 (1996-01-01), Tomura et al.
patent: 5487218 (1996-01-01), Bhatt et al.
patent: 5489804 (1996-02-01), Pasch
patent: 5493096 (1996-02-01), Koh
patent: 5508229 (1996-04-01), Baker
patent: 5525065 (1996-06-01), Sobhani
patent: 5536973 (1996-07-01), Yamaji
patent: 5542601 (1996-08-01), Fallon et al.
patent: 5547740 (1996-08-01), Higdon et al.
patent: 5556810 (1996-09-01), Fujitsu
patent: 5556814 (1996-09-01), Inoue et al.
patent: 5564181 (1996-10-01), Dineen et al.
patent: 5572069 (1996-11-01), Schneider
patent: 5576052 (1996-11-01), Arledge et al.
patent: 5583073 (1996-12-01), Lin et al.
patent: 5595943 (1997-01-01), Itabashi et al.
patent: 5599744 (1997-02-01), Koh et al.
patent: 5611140 (1997-03-01), Kulesza et al.
patent: 5611884 (1997-03-01), Bearinger et al.
patent: 5613296 (1997-03-01), Kurino et al.
patent: 5614114 (1997-03-01), Owen
patent: 5615477 (1997-04-01), Sweitzer
patent: 5619791 (1997-04-01), Lambrecht, Jr. et al.
patent: 5627405 (1997-05-01), Chillara
patent: 5627406 (1997-05-01), Pace
patent: 5633204 (1997-05-01), Tago et al.
patent: 5637920 (1997-06-01), Loo
patent: 5641113 (1997-06-01), Somaki et al.
patent: 5645628 (1997-07-01), Endo et al.
patent: 5646067 (1997-07-01), Gaul
patent: 5648686 (1997-07-01), Hirano et al.
patent: 5654584 (1997-08-01), Fujitsu
patent: 5656858 (1997-08-01), Kondo et al.
patent: 5663598 (1997-09-01), Lake et al.
patent: 5665652 (1997-09-01), Shimizu
patent: 5666008 (1997-09-01), Tomita et al.
patent: 5669545 (1997-09-01), Pham et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5674787 (1997-10-01), Zhao et al.
patent: 5682061 (1997-10-01), Khandros et al.
patent: 5686353 (1997-11-01), Yagi et al.
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5722162 (1998-03-01), Chou et al.
patent: 5723369 (1998-03-01), Barber
patent: 5731223 (1998-03-01), Padmanabhan
patent: 5736456 (1998-04-01), Akram
patent: 5739585 (1998-04-01), Akram et al.
patent: 5744859 (1998-04-01), Ouchida
patent: 5757071 (1998-05-01), Bhansali
patent: 5757081 (1998-05-01), Chang et al.
patent: 5764486 (1998-06-01), Pendse
patent: 5774340 (1998-06-01), Chang et al.
patent: 5789271 (1998-08-01), Akram
patent: 5798285 (1998-08-01), Bentlage et al.
patent: 5801072 (1998-09-01), Barber
patent: 5801447 (1998-09-01), Hirano et al.
patent: 5803340 (1998-09-01), Yeh et al.
patent: 5804771 (1998-09-01), McMahon et al.
patent: 5808360 (1998-09-01), Akram
patent: 5811879 (1998-09-01), Akram
patent: 5813115 (1998-09-01), Misawa et al.
patent: 5817541 (1998-10-01), Averkiou et al.
patent: 5822856 (1998-10-01), Bhatt et al.
patent: 5834844 (1998-11-01), Akagawa et al.
patent: 5861666 (1999-01-01), Bellaar
patent: 5863816 (1999-01-01), Cho
patent: 5870289 (1999-02-01), Tokuda et al.
patent: 5883435 (1999-03-01), Geffken et al.
patent: 5925931 (1999-07-01), Yamamoto
patent: 5994222 (1999-11-01), Smith et al.
patent: 6012224 (2000-01-01), DiStefano et al.
patent: 6013877 (2000-01-01), Degani et al.
patent: 6017812 (2000-01-01), Yonezawa et al.
patent: 6018196 (2000-01-01), Noddin
patent: 6020561 (2000-02-01), Ishida et al.
patent: 6037665 (2000-03-01), Miyazaki
patent: 6046909 (2000-04-01), Joy
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6084781 (2000-07-01), Klein
patent: 6088236 (2000-07-01), Tomura et al.
patent: 6103552 (2000-08-01), Lin
patent: 6103992 (2000-08-01), Noddin
patent: 6127204 (2000-10-01), Isaacs et al.
patent: 6159770 (2000-12-01), Tetaka et al.
patent: 0 718 882 (1996-06-01), None
patent: WO 97/38563 (1997-10-01), None
patent: WO 99/57762 (1999-11-01), None
Markstein et al., “Controlling the Variables in Stencil Printing,” Electronic Packaging & Production, Feb. 1997, pp. 48-56.
Elenius, “Choosing a Flip Chip Bumping Supplier—Technology an IC Package contractor should look for,” Advanced Packaging, Mar./Apr. 1998, pp. 70-73.
Erickson, “Wafer Bumping: The Missing Link for DCA,” Electronic Packaging & Production, Jul. 1998, pp. 43-46.
Kuchenmeister et al., “Film Chip Interconnection Systems Prepared By Wet Chemical Metallization,” IEEE publication 0-7803-4526-6/98, Jun. 1998, 5 pages.
Ghaffarian, “Long Time BGA Assembly Reliability,” Advancing Microelectronics, vol. 25, No. 6, Sep./Oct. 1998, pp. 20-23.
U.S. Appl. No. 09/465,024, filed Dec. 16, 1999, entitled “Bumpless Flip Chip Assembly With Solder Via”.
U.S. Appl. No. 09/464,562, filed Dec. 16, 1999, entitled “Bumpless Flip Chip Assembly With Strips And Via-Fill”.
U.S. Appl. No. 09/464,561, filed Dec. 16, 1999, entitled “Bumpless Flip Chip Assembly With Strips-In-Via And Plating”.
U.S. Appl. No. 09/120,408, filed Jul. 22, 1998, entitled “Flip Chip Assembly With Via Interconnection”.
U.S. Appl. No. 09/643,212, filed Aug. 22, 2000, entitled “Semiconductor Chip Assembley With Simultaneously Electroplated Contact Terminal and Connection Joint”.
U.S. Appl. No. 09/643,214, filed Aug. 22, 2000, entitled “Semiconductor Chip Assembly with Simultaneously Electrolessly Plated Contact Terminal and Connection Joint”.
U.S. Appl. No. 09/643,213, filed Aug. 22, 2000, entitled “Method of Making A Support Circuit For A Semiconductor Chip Assembl
Bridge Semiconductor Corporation
Luu Chuong Anh
Sigmond David M.
Smith Matthew
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