Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-12-27
2005-12-27
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C174S266000, C257S737000, C257S738000, C257SE23023, C257SE23067, C257SE23069, C257SE23070
Reexamination Certificate
active
06979896
ABSTRACT:
An electrical device includes electrical contact pads, a supply voltage bus and an interconnection circuit. The electrical contact pads receive a supply voltage, and the bus is electrically connected to the electrical contact pads. For each electrical contact pad, the interconnection circuit forms a redundant connection between the bus and the electrical contact pad. The electrical device may include a passivation layer that includes windows to establish electrical contact between the electrical contact pads and the supply voltage bus. This window may be elongated in a path that is generally aligned with the path along which the supply voltage bus extends.
REFERENCES:
patent: 5591941 (1997-01-01), Acocella et al.
Intel Corporation
Nelms David
Tran Mai-Huong
Trop Pruner & Hu P.C.
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