Die down multi-media card and method of making same

Details Die down multi-media card and method of making same Die down multi-media card and method of making same

2005-06-28

2005-06-28

Frech, Karl D. (Department: 2876)

Registers

Records

C235S488000

Reexamination Certificate

active

06910635

ABSTRACT:
A circuit module comprising a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. The traces are bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes. Attached to the die pad is a semiconductor die which extends along a die plane disposed between and generally parallel to the frame planes. The semiconductor die is electrically connected to at least one of the traces. A body at least partially encapsulates the leadframe and the semiconductor die such that the die pad is exposed within a top surface defined by the body and the contacts are exposed within a bottom surface defined by the body.

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