Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2005-11-22
2005-11-22
Quach, T. N. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S760000, C438S623000, C438S624000
Reexamination Certificate
active
06967407
ABSTRACT:
A semiconductor device capable of high speed operation with a substantially small interlayer capacitance is produced by steps of using an insulating film comprising an organic insulating film and an insulating film composed of an organometallic polymer material as an interlayer insulating film formed by coating, patterning the insulating film in a semi-thermosetting state, etching the organic insulating film as the lower layer by means of the organometallic polymer as a mask, using a plasma gas containing oxygen as the main component, and then conducting ultimate baking treatment of these insulating films.
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IEEE International Electron Devices Meeting Technical Digest, 1999, pp. 623-626.
Hotta Katsuhiko
Inoue Takashi
Otani Miharu
Suzuki Yasumichi
Tanaka Jun
Mattingly ,Stanger ,Malur & Brundidge, P.C.
Quach T. N.
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