Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-08-30
2005-08-30
Garrett, Dawn L. (Department: 1774)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C428S690000, C428S917000, C428S068000, C428S076000, C428S3550RA, C313S512000, C257S100000, C427S066000
Reexamination Certificate
active
06936131
ABSTRACT:
Disclosed herein are organic electronic devices that are encapsulated at least in part by adsorbent-loaded transfer adhesives. The adsorbent material may be a dessicant and/or a getterer. The adsorbent-loaded transfer adhesive may form a gasket around the periphery of the device, or may cover the entire device and its periphery. An encapsulating lid covers the device.
REFERENCES:
patent: 4829213 (1989-05-01), Pecile et al.
patent: 5061549 (1991-10-01), Shores
patent: 5112882 (1992-05-01), Babu et al.
patent: 5239228 (1993-08-01), Taniguchi et al.
patent: 5244707 (1993-09-01), Shores
patent: 5304419 (1994-04-01), Shores
patent: 5362421 (1994-11-01), Kropp et al.
patent: 5401536 (1995-03-01), Shores
patent: 5591379 (1997-01-01), Shores
patent: 5672400 (1997-09-01), Hansen et al.
patent: 5686360 (1997-11-01), Harvey, III et al.
patent: 5744557 (1998-04-01), McCormick et al.
patent: 5874804 (1999-02-01), Rogers
patent: 6081071 (2000-06-01), Rogers
patent: 6103141 (2000-08-01), Incorvia et al.
patent: 2002/0146533 (2002-10-01), Chung et al.
patent: 2003/0080677 (2003-05-01), Mikhael et al.
patent: 0 577 276 (1997-08-01), None
patent: 1 021 070 (2000-07-01), None
patent: 95169567 (1995-07-01), None
patent: 08124677 (1996-05-01), None
patent: 2000 030857 (2000-01-01), None
patent: 00123968 (2000-04-01), None
patent: 2000150141 (2000-05-01), None
patent: 2000-208251 (2000-07-01), None
patent: 2000 306664 (2000-11-01), None
patent: 2000311782 (2000-11-01), None
patent: WO 97/43352 (1997-11-01), None
patent: WO 00/06663 (2000-02-01), None
patent: WO 02/05361 (2002-01-01), None
Baude Paul F.
Haase Michael A.
McCormick Fred B.
3M Innovative Properties Company
Garrett Dawn L.
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