Encapsulation of organic electronic devices using adsorbent...

Details Encapsulation of organic electronic devices using adsorbent... Encapsulation of organic electronic devices using adsorbent...

2005-08-30

2005-08-30

Garrett, Dawn L. (Department: 1774)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C428S690000, C428S917000, C428S068000, C428S076000, C428S3550RA, C313S512000, C257S100000, C427S066000

Reexamination Certificate

active

06936131

ABSTRACT:
Disclosed herein are organic electronic devices that are encapsulated at least in part by adsorbent-loaded transfer adhesives. The adsorbent material may be a dessicant and/or a getterer. The adsorbent-loaded transfer adhesive may form a gasket around the periphery of the device, or may cover the entire device and its periphery. An encapsulating lid covers the device.

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