Arrangement and method for processing electrical substrates...

Electric heating – Metal heating – By arc

Reexamination Certificate

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Reexamination Certificate

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06849823

ABSTRACT:
For processing electric circuit substrates, a laser source with a diode-pumped. quality-controlled, pulsed solid-state laser is used. The laser is able to emit laser radiation with a wavelength between 266 nm and 1064 nm, a pulse repetition rate between 1 kHz and 1 MHz and a pulse length of 30 ns to 200 ns with an average laser power between 1 W and around 5 W. Pre-specified operating modes can be set via a controller, depending on an area of application, with the appropriate different combinations of laser power and repetition rate. Thus, the same laser can optionally be used to perform a drilling operation, an etch removal operation or an exposure operation. Using a galvo mirror deflector unit that can also be controlled via the deflection unit, the laser beam may be deflected on the substrate in accordance with the relevant operating mode.

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patent: 5593606 (1997-01-01), Owen et al.
patent: 6541731 (2003-04-01), Mead et al.
patent: 6576869 (2003-06-01), Gower et al.
patent: 6756563 (2004-06-01), Gross et al.
patent: 6781090 (2004-08-01), Sun et al.
patent: 931 439 (2000-06-01), None
patent: 1 115 031 (2001-07-01), None

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