Method for attaching an integrated circuit package to a...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S860000, C228S180210, C228S180210, C174S260000

Reexamination Certificate

active

06978539

ABSTRACT:
A method for attaching an IC package to a circuit board, the IC package having a plurality of electrical contacts in an arrangement having a perimeter, first positions the IC package adjacent to the circuit board. Then, electrically connects the IC package to the circuit board through the plurality of electrical contacts. The method finally, disposes at least one anchor mechanically attaching the IC package to the circuit board, the anchor disposed at a location outside of the perimeter of the plurality of electrical contacts. The type, quantity, and exact geometry of the anchors depend on the specific design parameters of the IC package and circuit board.

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patent: 1999-163043 (1999-06-01), None

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