Solder reflow processor

Details Solder reflow processor Solder reflow processor

1994-04-14

1996-06-11

Ramsey, Kenneth J.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Gaseous flux

219388, B23K 1012

Patent

active

055248101

ABSTRACT:
A tunnel-type processor for solder flow application of solder connections to circuit elements on a circuit board. The boards with deposited solder are passed through a heating zone and a cooling zone, on a platen. Heated or cooled gas is injected into the zones to maintain a suitable temperature along with the platen. A housing with an exhaust conduit encloses the platen and limits flow of gas from one zone into another. An optional top manifold can be provided to discharge gas into a respective zone.

REFERENCES:
patent: 4938410 (1990-07-01), Kondo
patent: 5069380 (1991-12-01), Deamborsio
patent: 5230460 (1993-07-01), Deamborsio et al.

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