Heater module for semiconductor manufacturing equipment

Details Heater module for semiconductor manufacturing equipment Heater module for semiconductor manufacturing equipment

2005-11-08

2005-11-08

Paik, Sang (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C118S724000

Reexamination Certificate

active

06963052

ABSTRACT:
Heater module, and semiconductor manufacturing equipment in which the heater module is utilized, for raising the cooling speed of a post-heating heater markedly more than conventional, and that can contribute toward bettering and improving productivity, without accompanying scaling-up of and cost increases in the semiconductor manufacturing equipment. The heater module is furnished with heater part1afor controlled heating of a wafer placed on its top face, and block part3aprovided to be shiftable relative to said heater part, for varying heat capacity in total with heater part1aby abutting on or separating from the reverse surface of heater part1a. By having the heat capacity of block part3abe 20% or more of the total heat capacity of heater part1aand block part3a, the heater cooling speed can be made 10° C./min or more.

REFERENCES:
patent: 5140895 (1992-08-01), Imanishi
patent: 5372648 (1994-12-01), Yamamoto et al.
patent: 5665166 (1997-09-01), Deguchi et al.
patent: 6072163 (2000-06-01), Armstrong et al.
patent: H08-130237 (1996-05-01), None

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