Connection of integrated circuits

Details Connection of integrated circuits Connection of integrated circuits

2005-12-27

2005-12-27

Schillinger, Laura M. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S106000, C257S686000, C257S777000, C257S778000

Reexamination Certificate

active

06979591

ABSTRACT:
A method for connecting a first integrated circuit having an elevated contact area lying on an elastic elevation on a main area thereof and a second integrated circuit having a corresponding non-elevated contact area on a main area thereof includes applying a liquid adhesive between the first and second main areas; aligning the first and second main areas so that the elevated contact area is opposite the corresponding non-elevated contact area; and curing the adhesive, thereby firmly connecting the first and second integrated circuits.

REFERENCES:
patent: 4818728 (1989-04-01), Rai et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5328087 (1994-07-01), Nelson et al.
patent: 5477087 (1995-12-01), Kawakita et al.
patent: 5598033 (1997-01-01), Behlen et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5801446 (1998-09-01), DiStefano et al.
patent: 5898223 (1999-04-01), Frye et al.
patent: 6077723 (2000-06-01), Farnworth et al.
patent: 6239983 (2001-05-01), Shingai et al.
patent: 6335571 (2002-01-01), Capote et al.
patent: 6462420 (2002-10-01), Hikita et al.
patent: 6822317 (2004-11-01), Inoue et al.
patent: 6885106 (2005-04-01), Damberg et al.
patent: 2002/0121706 (2002-09-01), Tatsuta et al.
patent: 2002/0130412 (2002-09-01), Nagai et al.
patent: 2003/0038355 (2003-02-01), Derderian
patent: 2003/0067755 (2003-04-01), Haimerl et al.
patent: 42 26 167 (1994-02-01), None
patent: 2000114386 (2000-04-01), None
patent: 2000232200 (2000-08-01), None
patent: WO 01/75969 (2001-10-01), None

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