Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate
2005-12-13
2005-12-13
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
C438S003000, C438S240000
Reexamination Certificate
active
06974754
ABSTRACT:
An embodiment of the present invention is a method of fabricating a semiconductor device. The method comprises forming a film of bottom electrode material entirely over the dielectric film; etching the bottom electrode film to partially define a sidewall of each of bottom electrodes; forming a film of ferroelectric material on the remainder of the bottom electrode film and the exposed surface of the dielectric film; forming a film of top electrode material on the ferroelectric film; and etching the top electrode film, the ferroelectric film and the remainder of the bottom electrode film until the surface of the dielectric film is exposed to completely define the sidewall of each of the bottom electrodes.
REFERENCES:
patent: 6548343 (2003-04-01), Summerfelt et al.
patent: 6600183 (2003-07-01), Visokay et al.
patent: 6727156 (2004-04-01), Jung et al.
patent: 2001/0010377 (2001-08-01), Cuchiaro et al.
patent: 2001/0038115 (2001-11-01), Amanuma
patent: 11-317500 (1999-11-01), None
Hoang Quoc
NEC Electronics Corporation
Sughrue & Mion, PLLC
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