Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask
Reexamination Certificate
2005-02-22
2005-02-22
Huff, Mark F. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Radiation modifying product or process of making
Radiation mask
C216S017000
Reexamination Certificate
active
06858352
ABSTRACT:
A mask for producing a printed circuit board is defined in which the conductor elements of the printed circuit pattern are delineated by a constant width etch band (20). This means that all conductors (3a, 3b, 9) are separated from neighboring areas of conductive material (22) by the same distance. Thus etch rates across the printed circuit pattern do not vary according to the separation of the conductors (3a, 3b, 9).
REFERENCES:
patent: 3775119 (1973-11-01), Bemis
patent: 5019486 (1991-05-01), Takakura
patent: 5790383 (1998-08-01), Inagawa
patent: 5989754 (1999-11-01), Chen et al.
patent: 6210843 (2001-04-01), Chen et al.
patent: 19 36 775 (1971-03-01), None
patent: 41 31 065 (1993-03-01), None
patent: 784 673 (1957-10-01), None
“Laser Scribed Labyrinte Type Circuit for Circuit Board”; IBM Technical Disclosure Bulletin; Armonk, NY; vol. 32, No. 6B; pp. 359-361; Nov. 1989; XP000073766.
Tanaka, Yasuo et al; “Three Micron Meter Copper Foil Clad Laminate for 30/30 MCRON Meter Line/Space Circuit”; Circuitree; pp. 40-44; Nov. 1997; XP000978483.
“Subractive Etch Promoting Dummy Lines”; IBM Technical Disclosure Bulletin; Armonk, NY; vol. 32, No. 3B; p. 323; Aug. 1989; XP000029839.
Huff Mark F.
Isis Innovation Limited
Mohamedulla Saleha
Nixon & Vanderhye PC
LandOfFree
Printed circuit fabrication does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit fabrication, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit fabrication will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3480263