System and method for high performance heat sink for...

Details System and method for high performance heat sink for... System and method for high performance heat sink for...

2005-12-27

2005-12-27

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000, C257S717000, C257S720000

Reexamination Certificate

active

06979899

ABSTRACT:
A custom-molded heat sink corresponds to an individual substrate and includes a heat sink lid having at least one cavity corresponding to at least one die mounted on a substrate. A conductive layer is deposited in the at least one cavity that substantially fills the space between the at least one cavity and the at least one die when the lid is coupled to the substrate.

REFERENCES:
patent: 5623394 (1997-04-01), Sherif et al.
patent: 5819402 (1998-10-01), Edwards et al.
patent: 6656770 (2003-12-01), Atwood et al.
patent: 6724078 (2004-04-01), Sur et al.
patent: 6756668 (2004-06-01), Baek et al.
patent: 2003/0178730 (2003-09-01), Rumer et al.
patent: 2004/0000712 (2004-01-01), Wilson et al.

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