Method and apparatus for liquid-treating and drying a substrate

Details Method and apparatus for liquid-treating and drying a substrate Method and apparatus for liquid-treating and drying a substrate

2005-06-28

2005-06-28

Stinson, Frankie L. (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

C134S099100, C134S198000, C134S199000, C134S902000

Reexamination Certificate

active

06910487

ABSTRACT:
The present invention is related to a method and apparatus for liquid treating and drying a substrate, such as a semiconductor wafer, the method comprising the step of immersing a substrate or a batch of substrates in a tank filled with a liquid, and removing the substrate(s) through an opening so that a flow of the liquid takes place through the opening during removal of the substrate. Simultaneously with the removal, a reduction of the surface tension of the liquid is caused to take place near the intersection line between the liquid and the substrate. For acquiring such a tensio-active effect, a uniform flow of a gas or vapor is used, or/and a local application of heat. The invention is equally related to an apparatus for performing the method of the invention.

REFERENCES:
patent: 3865298 (1975-02-01), Allen et al.
patent: 5569330 (1996-10-01), Schild et al.
patent: 5571337 (1996-11-01), Mohindra et al.
patent: 6119367 (2000-09-01), Kamikawa et al.
patent: 6119708 (2000-09-01), Fishkin et al.
patent: 6138698 (2000-10-01), Tanaka et al.
patent: 6199564 (2001-03-01), Yokomizo
patent: 6216709 (2001-04-01), Fung et al.
patent: 6328814 (2001-12-01), Fishkin et al.
patent: 6342104 (2002-01-01), Kamikawa et al.
patent: 6354311 (2002-03-01), Kimura et al.
patent: 6401732 (2002-06-01), Bergman
patent: 6412501 (2002-07-01), Onoda et al.
patent: 6412504 (2002-07-01), Oravec
patent: 6637444 (2003-10-01), Zuck et al.
patent: 2001/0007259 (2001-07-01), Nakashima et al.
patent: 44 13 077 (1995-10-01), None
patent: 0 385 536 (1990-09-01), None
patent: 0 817 246 (1998-01-01), None
patent: 4-151835 (1992-05-01), None
patent: 5-102120 (1993-04-01), None
patent: 5-102121 (1993-04-01), None
patent: 5-152273 (1993-06-01), None
patent: 99/08057 (1999-02-01), None

Affiliated with

Also associated with

Rating

Method and apparatus for liquid-treating and drying a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for liquid-treating and drying a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for liquid-treating and drying a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3477631