Selective area solder placement

Details Selective area solder placement Selective area solder placement

2005-08-23

2005-08-23

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C174S265000, C361S779000, C228S056300

Reexamination Certificate

active

06933449

ABSTRACT:
A printed circuit board having at least one layer of conductive traces on an external surface has at least one preformed solder element placed on a conductive trace area of the printed circuit board requiring a greater than standard amount of solder. The at least one preformed solder element is reflowed to form a connection with the layer of printed solder.

REFERENCES:
patent: 5070604 (1991-12-01), Banba et al.
patent: 5242097 (1993-09-01), Socha
patent: 5296649 (1994-03-01), Kosuga et al.
patent: 5373984 (1994-12-01), Wentworth
patent: 6179631 (2001-01-01), Downes et al.
patent: 6181565 (2001-01-01), Schmitt et al.
patent: 6273327 (2001-08-01), Murray, Jr. et al.
patent: 6680843 (2004-01-01), Farrow et al.
patent: 05-198932 (1993-08-01), None
patent: 06-275944 (1994-09-01), None
patent: 07-038246 (1995-02-01), None
patent: 08-274454 (1996-10-01), None
patent: 10-244395 (1998-09-01), None
patent: 11-019792 (1999-01-01), None
patent: 2001-015901 (2001-01-01), None
patent: 2001-237535 (2001-08-01), None
Computer translation of Japanese Patent Publicatin No. 07038246 (admitted prior art submitted by the applicant).
Computer translation of Japaneses Patent Publicatin No. 10244395 (admitted prior art submitted by the applicant).

Affiliated with

Also associated with

Rating

Selective area solder placement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Selective area solder placement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Selective area solder placement will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3477361