Package with pre-applied underfill and associated methods

Details Package with pre-applied underfill and associated methods Package with pre-applied underfill and associated methods

2005-08-09

2005-08-09

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S108000, C438S119000, C257S782000, C257S783000

Reexamination Certificate

active

06927097

ABSTRACT:
An underfill material is applied to an electronic component, such as a die, integrated circuit (IC) package, or printed circuit board, prior to mounting of the component upon another packaging element. In an embodiment, the component may be a singulated IC package. Strips of underfill material may be separated from a supply reel and applied to the edges of the IC package. Trays may convey the components to and from automated underfill attach equipment. Assembly methods, as well as application of the package to an electronic assembly and to an electronic system, are also described.

REFERENCES:
patent: 5535101 (1996-07-01), Miles et al.
patent: 6300686 (2001-10-01), Hirano et al.
patent: 2002/0162679 (2002-11-01), Hannan et al.
Chang, Benjamin, et al., “CARIVERSE Resin: A Thermally Reversible Network Polymer for Electronic Applications”,49th Electronic Components&Technology Conference, (Jun. 1999), 49-55.

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