Metal working – Method of mechanical manufacture – Fluid pattern dispersing device making – e.g. – ink jet
Reexamination Certificate
2005-08-30
2005-08-30
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Fluid pattern dispersing device making, e.g., ink jet
C029S611000, C029S852000, C029S846000, C427S096900, C427S097700, C427S103000, C216S027000
Reexamination Certificate
active
06935023
ABSTRACT:
A method of forming an electrical connection for a fluid ejection device including a fluid channel communicating with a first side and a second side of the fluid ejection device and an array of drop ejecting elements formed on the first side of the fluid ejection device includes forming a trench in the second side of the fluid ejection device, depositing a conductive material in the trench, forming a first opening in the fluid ejection device between the first side of the fluid ejection device and the conductive material in the trench, depositing a conductive material in the first opening, and forming a conductive path between the conductive material in the first opening and a wiring line of one of the drop ejecting elements.
REFERENCES:
patent: 3903427 (1975-09-01), Pack
patent: 4309083 (1982-01-01), Duchene et al.
patent: 4348253 (1982-09-01), Subbarao et al.
patent: 4348685 (1982-09-01), Jaouannet et al.
patent: 4400709 (1983-08-01), de Kermadec et al.
patent: 4445978 (1984-05-01), Whartenby et al.
patent: 4566186 (1986-01-01), Bauer et al.
patent: 4789425 (1988-12-01), Drake et al.
patent: 4791440 (1988-12-01), Eldridge et al.
patent: 4917286 (1990-04-01), Pollacek
patent: 4961821 (1990-10-01), Drake et al.
patent: 4964212 (1990-10-01), Deroux-Dauphin et al.
patent: 5016023 (1991-05-01), Chan et al.
patent: 5037782 (1991-08-01), Nakamura et al.
patent: 5057854 (1991-10-01), Pond et al.
patent: 5148595 (1992-09-01), Doggett et al.
patent: 5160945 (1992-11-01), Drake
patent: 5166097 (1992-11-01), Tanielian
patent: 5227812 (1993-07-01), Watanabe et al.
patent: 5322594 (1994-06-01), Bol
patent: 5416971 (1995-05-01), Hegazi et al.
patent: 5425816 (1995-06-01), Cavicchi et al.
patent: 5469199 (1995-11-01), Allen et al.
patent: 5469201 (1995-11-01), Erickson et al.
patent: 5598196 (1997-01-01), Braun
patent: 5599744 (1997-02-01), Koh et al.
patent: 5617131 (1997-04-01), Murano et al.
patent: 5629241 (1997-05-01), Matloubian et al.
patent: 5643353 (1997-07-01), Wallace et al.
patent: 5851894 (1998-12-01), Ramm
patent: 5985521 (1999-11-01), Hirano et al.
patent: 6078186 (2000-06-01), Hembree et al.
patent: 6096635 (2000-08-01), Mou et al.
patent: 6107109 (2000-08-01), Akram et al.
patent: 6110825 (2000-08-01), Mastromatteo et al.
patent: 6143190 (2000-11-01), Yagi et al.
patent: 6197664 (2001-03-01), Lee et al.
patent: 6221769 (2001-04-01), Dhong et al.
patent: 2001/0027002 (2001-10-01), Matsumoto
patent: 0289347 (1988-11-01), None
patent: 0510274 (1991-04-01), None
patent: 0430692 (1991-06-01), None
patent: 0594310 (1993-09-01), None
patent: 0666174 (1995-08-01), None
patent: 0668167 (1995-08-01), None
patent: 0710560 (1996-05-01), None
patent: 04173262 (1992-06-01), None
Peeters et al., “Thermal Ink Jet Technology”, Circuits and Devices Magazine, IEEE, vol. 13, Issue 4, pp. 19-23, Jul. 1997.
Kuhmann et al., Through Wafer Interconnects and Flip-Chip Bonding: A Toolbox for Advanced Hybrid Technologies for MEMS.
Imler, Scholz, Cobarruviaz, Nagesh, Chaw, Haitz, “Precision Flip-Chip Solder Bump Interconnects f r Optical Packaging”, IEEE Transactions on Components, Hybrids, and Manufacturing Tech., vol. 15, #6, 1992, pp. 997-982.
Itoh, Sasaki, Uda, Yoneda, Honmou, Fukushima, “Use of AuSn Solder Bumps in Three-dimensional Passive Aligned Packaging of LD/PD Arrays on Si Optical Benches”, IEEE Electronic Components and Technology Conf., 1996, pp. 1-7.
Deshmukh, Brady, Roll, King, Shmulovi , Zolonowski, “Activ Atm sph r Sold r Self-Alignm nt and Bonding of Optical Components”, Intl. Journal of Microcircuits and Electronic Packaging, vol. 16, #2, 1993, pp. 97-107.
Ludwig, “Multilayered Focal Plane Structures With Self-Aligning Detector Assembly”, Infrared Readout Electronics III, SPIE, vol. 2745, 1996, pp. 149-158.
Kallmayer, Oppenmann, Kloesen, Zakel, Reichi, “Experimental Results on the Self-Alignment Process Using Au/Sn Metallurgy and on the Growth of the C-Phase During the Reflow”, 95 Flip Chip, BGA, TAB & AP Symposium, 1995, pp. 225-236.
Linder, Baltes, Gnaedinger, Doering, “Photolithography in Anisotropically Etched Groov s”, IEEE 9th Intl. Workshop on MEMS, 1996, pp. 38-43.
Kuhmann et al., “Through Wafer Interconnects and Flip-Chip Bonding: A Toolbox for Advanced Hybrid Technologies for MEMS,” pp. 1-8.
Beerling Timothy E.
Boyd Melissa D.
Weber Timothy L.
LandOfFree
Method of forming electrical connection for fluid ejection... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming electrical connection for fluid ejection..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming electrical connection for fluid ejection... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3476700