Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-02-22
2005-02-22
Osele, Mark A. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S254000, C156S247000, C225S002000, C125S023010, C438S407000, C438S977000
Reexamination Certificate
active
06858107
ABSTRACT:
A method of fabricating substrates while minimizing loss of starting material of an ingot, wherein a layer is transferred onto a support. The technique includes forming a flat front face on a raw ingot of material, implanting atomic species through the front face to a controlled mean implantation depth to create a zone of weakness that defines a top layer of the ingot, bonding a support to the front face of the ingot, wherein the support has a surface area that is smaller than a surface area of the front face of the ingot, and detaching from the ingot at the zone of weakness that portion of the top layer that is bonded to the support to form the substrate.
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Ghyselen Bruno
Letertre Fabrice
Osele Mark A.
S.O.I. Tec Silicon on Insulator Technologies S.A.
Winston & Strawn LLP
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