Abrading – Abrading process – Utilizing fluent abradant
Reexamination Certificate
2005-08-30
2005-08-30
Morgan, Eileen P. (Department: 3723)
Abrading
Abrading process
Utilizing fluent abradant
C451S041000, C451S054000, C451S287000
Reexamination Certificate
active
06935926
ABSTRACT:
The fabrication of integrated circuits entails the repeated application of many basic processing steps, for instance, planarization—the process of making a surface flat, or planar. One specific technique for making surfaces flat is chemical-mechanical planarization, which typically entails applying slurry onto a surface of an integrated circuit and polishing the surface with a rotating polishing head. The head includes several holes, known as slurry dispensers, through which slurry is applied to the surface. After completion of a polishing operation, gas is forced through the slurry dispensers to separate the surface from the rotating head. Unfortunately, the gas dries slurry remaining on the surface, causing slurry particles to stick to the polished surface, which ultimately cause defects in integrated circuits. Accordingly, the inventor devised a new method of polishing that applies a polishing head to a surface, dispenses slurry through a slurry dispenser in the polishing head onto the surface, polishes the surface, and then dispenses a substantially particulate-free liquid through the slurry dispenser to facilitate separation of the polishing head and the surface and thereby avoid drying slurry on the surface.
REFERENCES:
patent: 5227001 (1993-07-01), Tamaki et al.
patent: RE34425 (1993-11-01), Schultz
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5514245 (1996-05-01), Doan et al.
patent: 5563709 (1996-10-01), Poultney
patent: 5643060 (1997-07-01), Sandhu et al.
patent: 5643061 (1997-07-01), Jackson et al.
patent: 5658183 (1997-08-01), Sandhu et al.
patent: 5664990 (1997-09-01), Adams et al.
patent: 5679169 (1997-10-01), Gonzales et al.
patent: 5700180 (1997-12-01), Sandhu et al.
patent: 5702292 (1997-12-01), Brunelli et al.
patent: 5730642 (1998-03-01), Sandhu et al.
patent: 5738567 (1998-04-01), Manzonie et al.
patent: 5762537 (1998-06-01), Sandhu et al.
patent: 5816900 (1998-10-01), Nagahara et al.
patent: 5842909 (1998-12-01), Sandhu et al.
patent: 5851135 (1998-12-01), Sandhu et al.
patent: 5894852 (1999-04-01), Gonzales et al.
patent: 5895550 (1999-04-01), Andreas
patent: 6336846 (2002-01-01), Park et al.
patent: 6558228 (2003-05-01), Cheng et al.
patent: 2002217147 (2002-08-01), None
“The World's Most Popular, Fully Automated CMP Tool”,IPEC Planar, CMP Equipment, Avanti 472 at http://207.108.158.32/planar/472.html,(Feb. 8, 1999), 1-4.
Blatt, C..,et al. ,“Integrated CMP and Post-CMP Cleaning Cluster Particle Removal with DI Water”,IPEC Planar,Process Paper at http://www.ipec.com/planar/paper2.html,(Jul. 9, 1998),1-6.
Holland, K..,et al. ,“Planarization by CMP for ULSI Applications”,IPEC Planar, Process Technology,Process Paper at http://www.ipec.com/planar/paper1.html,(Jul. 9, 1998),1-6.
IPEC,“Introducing the AvantGaard 676”,IPEC Planar,CMP Equipment, AvantGaard 676 at http://207.108.158.32/planar/676.html,(Feb. 8, 1999),1-8.
IPEC,“Introducing the AvantGaard 776, The World's Most Advanced CMP Technology”,IPEC Planar,CMP Equipment, AvantGaard 776 at http://207.108.158.32/planar/776.html,(Feb. 8, 1999),1-13.
Parikh, P..J. ,“Chemical Mechanical Planarization: An Analysis of Variables”,IPEC Planar,http://www.ipec.com/planar/paper3.html,(Jul. 9, 1998),1-9.
Micro)n Technology, Inc.
Morgan Eileen P.
Schwegman Lundberg Woessner & Kluth P.A.
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