Semiconductor device having multilayer wiring and...

Details Semiconductor device having multilayer wiring and... Semiconductor device having multilayer wiring and...

2005-11-01

2005-11-01

Smith, Matthew (Department: 2825)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S107000, C257S777000

Reexamination Certificate

active

06960492

ABSTRACT:
There is provided a method of manufacturing a semiconductor device having a number of wiring layers, comprising forming an underlayer, the underlayer including a substrate, at least one underlayer wiring layer provided on the substrate, and a first attachment surface, forming at least one upper structure, the upper structure including at least one upper wiring layer and a second attachment surface, and positioning the upper structure and the underlayer and attaching the first and second attachment surfaces to each other.

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