Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2005-08-16
2005-08-16
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Reexamination Certificate
active
06930020
ABSTRACT:
A method for transferring of individual devices or circuit elements, fabricated on a semiconducting substrate, to a new substrate and placing said devices and elements in predetermined locations on the new substrate. The method comprises shaping the devices and circuits as truncated cones, lifting them off the original semiconducting substrates and depositing them en masse onto the new substrate, followed by their placing into receptors on the new substrate. The new substrate has preliminarily made receptors in a form of a truncated cone and the devices and circuits fill these receptors. Both the receptors and the devices and circuits have metallization contacts enabling to establish electrical contact between them. A method for real-time monitoring and verification of correctness of placement of the devices and circuits into the receptors by applying voltage pulse waveforms and measuring the resulting current pulse.
REFERENCES:
patent: 5355577 (1994-10-01), Cohn
patent: 5545291 (1996-08-01), Smith et al.
patent: 5651176 (1997-07-01), Ma et al.
patent: 5783856 (1998-07-01), Smith et al.
patent: 5824186 (1998-10-01), Smith et al.
patent: 5904545 (1999-05-01), Smith et al.
patent: 6291266 (2001-09-01), Sayyah
patent: 2002/0064902 (2002-05-01), Sayyah
patent: 00/49658 (2000-08-01), None
patent: 02/45159 (2002-06-01), None
Bohringer, Karl-Friedrich, et al., “Electrostatic Self-Assembly Aided by Ultrasonic Vibration,” presented at the American Vacuum Society 44th Annual Symposium, San Jose, California, pp. 1-2 (Oct. 1997).
Carey, P.G., et al., “Poly-Si Thin Film Transistors Fabricated on Plastic Substrates,” IEEE, pp. 126-127 (1998).
Drobac, Stan, “Fluidic Self-Assembly Could Change the Way FPDs are Made,” Information Display, pp. 12-16 (1999).
Cohn, M.B., et al., “Self-Assembling Electrical Networks: An Application of Micromachining Technology,” IEEE,Proceedings of the International Conference on Solid State Sensors and Actuators, vol. Conf. 6, pp. 490-493 (Jun. 24, 1991).
Fourson George
HRL Laboratories LLC
Kebede Brook
Ladas & Parry LLP
LandOfFree
Method for fabricating large area flexible electronics does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for fabricating large area flexible electronics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating large area flexible electronics will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3473890