Method and apparatus for full surface electrotreating of a...

Details Method and apparatus for full surface electrotreating of a... Method and apparatus for full surface electrotreating of a...

2005-02-08

2005-02-08

Nicolas, Wesley A. (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating moving substrate

C205S149000, C205S157000, C205S103000, C205S652000, C205S654000, C205S662000, C205S663000, C205S686000, C204S22400M, C204S22400M, C204S279000, C204S228300

Reexamination Certificate

active

06852208

ABSTRACT:
Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.

REFERENCES:
patent: 6482307 (2002-11-01), Ashjaee et al.
patent: 6497800 (2002-12-01), Talieh et al.
patent: 6527925 (2003-03-01), Batz et al.

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