Utilize ultrasonic energy to reduce the initial contact...

Details Utilize ultrasonic energy to reduce the initial contact... Utilize ultrasonic energy to reduce the initial contact...

2005-02-08

2005-02-08

Stoner, Kiley (Department: 1725)

Metal fusion bonding

Process

Using high frequency vibratory energy

C228S001100, C228S103000

Reexamination Certificate

active

06851597

ABSTRACT:
A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

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U. S. patent application Publication No. US 2001/0045446 A1, published Nov. 29, 2001.
U. S. patent application Publication No. US 2001/0048018 A1, published Dec. 6, 2001.

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