Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2005-02-22
2005-02-22
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
With measuring or testing
C438S011000, C438S015000, C438S018000, C257S048000
Reexamination Certificate
active
06858451
ABSTRACT:
A method for manufacturing a dynamic quantity detection device that is formed by bonding a semiconductor chip that includes a detection element for detecting a dynamic quantity to a stand using a bonding layer includes: forming a semiconductor chip that includes a detection element used for correlating a dynamic quantity to be detected to an electric quantity and a plurality of processing circuit elements used for making up a circuit that processes the electric quantity; placing a bonding layer on a stand; placing the semiconductor chip on the bonding layer; bonding the semiconductor chip to the stand by sintering the bonding layer; and annealing the semiconductor chip in an atmosphere that contains hydrogen in order to cure a change, which is caused during the bonding of the semiconductor chip, in a characteristic of one of the processing circuit elements.
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Suzuki Yasutoshi
Yoshihara Shinji
Lee, Jr. Granvill D.
Smith Matthew
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