Method and apparatus for manufacturing semiconductor device

Details Method and apparatus for manufacturing semiconductor device Method and apparatus for manufacturing semiconductor device

2005-11-22

2005-11-22

Haran, John T. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S306300, C156S308200, C438S119000

Reexamination Certificate

active

06966964

ABSTRACT:
A method for manufacturing a semiconductor device whereby semiconductor elements like semiconductor bare chips are mounted with high productivity on both surfaces of a circuit board while preventing the board from warping, and an apparatus for manufacturing a semiconductor device for faithfully embodying the manufacturing method. Semiconductor elements temporarily fixed on both surfaces of a circuit board are heated while being pressurized in directions to be each pressed against the board, whereby adhesive on both surfaces of the board is thermally set simultaneously and bumps on each semiconductor elements are press-bonded to their opposing board electrodes on the board to be electrically connected. Ultraviolet rays are irradiated to a circumference of mixed curing adhesive applied to at least one surface of the circuit board to form an ultraviolet curing part only on the circumference of the adhesive, thereby increasing strength for temporarily fixing the semiconductor elements to the circuit board.

REFERENCES:
patent: 5366933 (1994-11-01), Golwalkar et al.
patent: 6071371 (2000-06-01), Leonard et al.
patent: 6072243 (2000-06-01), Nakanishi
patent: 2002/0079594 (2002-06-01), Sakurai

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