Integrated VCSELs on traditional VLSI packaging

Details Integrated VCSELs on traditional VLSI packaging Integrated VCSELs on traditional VLSI packaging

2005-12-13

2005-12-13

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S750000, C438S027000, C438S028000, C257S431000, C257S433000

Reexamination Certificate

active

06975514

ABSTRACT:
A circuit module including at least one Application Specific Integrated Circuit (ASIC) and a plurality of Vertical Cavity Surface-Emitting Laser (VCSEL) array modules is built using a standard ceramic or organic VLSI package substrate, resulting is a high density device with a small footprint. Interconnection between the electronic devices and the VCSEL array modules is accomplished using standard integrated circuit packaging technology and flexible connectors. Optical connections from the VCSEL arrays to fiber optic cables are made possible by integrating industry-standard optical connectors onto the package. Optical receiver and transceiver modules may also be incorporated into the circuit module.

REFERENCES:
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patent: 6069991 (2000-05-01), Hibbs-Brenner et al.
patent: 6334784 (2002-01-01), Howard
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A.F.J. Levi, “Optical Interconnects in Systems”, 2000, pp. 1-8.

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