Method for manufacturing a circuit board capable of...

Details Method for manufacturing a circuit board capable of... Method for manufacturing a circuit board capable of...

2005-06-07

2005-06-07

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S191000, C228S245000, C228S246000, C360S245800, C360S323000

Reexamination Certificate

active

06902099

ABSTRACT:
The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board comprises at least a pair of leads for constructing a circuit, lands connected respectively to the leads, and solder bumps formed respectively on the lands. The solder bumps are arranged in an adjacent relationship and, when the solder bumps are crushed, peripheral portions of the solder bumps are pressed or spread so as to overlap with each other. The magnetic head includes the circuit board.

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patent: 2001-060309 (2001-03-01), None

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