Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2005-02-15
2005-02-15
Alanko, Anita (Department: 1746)
Etching a substrate: processes
Forming or treating thermal ink jet article
Reexamination Certificate
active
06855264
ABSTRACT:
A method of manufacturing an ink jet printer having a thermal actuator comprising an external coil spring is disclosed wherein an array of nozzles are formed on a substrate utilising planar monolithic deposition, lithographic and etching processes. Multiple ink jet heads are preferably formed simultaneously on a single planar substrate. The substrate can be a silicon wafer. The print heads are preferably formed utilising standard vlsi/ulsi processing. Integrated drive electronics are preferably formed on the same substrate. The integrated drive electronics can comprise a CMOS process. Ink can be ejected from the substrate substantially normal to the substrate.
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