Composite lid for land grid array (LGA) flip-chip package...

Details Composite lid for land grid array (LGA) flip-chip package... Composite lid for land grid array (LGA) flip-chip package...

2005-03-01

2005-03-01

Smith, Matthew (Department: 2825)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S704000, C257S710000

Reexamination Certificate

active

06861292

ABSTRACT:
A composite lid for a semiconductor package, in which the lid includes at least two materials. The first material is disposed over and attached to the back surface of the die with a low-modulus thermal gel, and the second material is disposed towards the perimeter of the lid. The second material has a modulus of elasticity greater than the modulus of elasticity of the first material, and preferable, at least twice that of the first material.

REFERENCES:
patent: 6317326 (2001-11-01), Vogel et al.
patent: 6665187 (2003-12-01), Alcoe et al.
patent: 20030042598 (2003-03-01), Crane et al.
patent: 20040036183 (2004-02-01), Im et al.

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