Land grid array structure

Details Land grid array structure Land grid array structure

2005-10-18

2005-10-18

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S827000, C029S830000, C029S831000, C029S846000, C029S854000, C174S254000, C174S260000, C174S262000

Reexamination Certificate

active

06954984

ABSTRACT:
A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.

REFERENCES:
patent: 4549200 (1985-10-01), Ecker et al.
patent: 4652974 (1987-03-01), Ryan
patent: 4803595 (1989-02-01), Kraus et al.
patent: 5060116 (1991-10-01), Grobman et al.
patent: 5177594 (1993-01-01), Chance et al.
patent: 5243140 (1993-09-01), Bhatia et al.
patent: 6428327 (2002-08-01), Tamarkin et al.
http://www.cinch.com/products/cinapse/index.html “CIN::APSE High Speed Interconnect Technology” pp. 1-4.

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