Semiconductor device, semiconductor module and hard disk

Details Semiconductor device, semiconductor module and hard disk Semiconductor device, semiconductor module and hard disk

2005-05-17

2005-05-17

Zarabian, Amir (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S675000, C257S706000

Reexamination Certificate

active

06894375

ABSTRACT:
A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a flexible sheet become substantially within a same plane, so that it is readily affixed to a second supporting member (24). In addition, the top surface of the heat radiation electrode (15) is made protrusive beyond the top surfaces of the pads (14) to reduce the distance between the semiconductor chip (16) and the heat radiation electrode (15). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24).

REFERENCES:
patent: 5543663 (1996-08-01), Takubo
patent: 5869894 (1999-02-01), Degani et al.
patent: 6404049 (2002-06-01), Shibamoto et al.
Nikki Electronics; No. 691, Jun. 16, 1997, pp. 92-120.

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