Semiconductor device

Details Semiconductor device Semiconductor device

2005-02-22

2005-02-22

Clark, S. V. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S686000

Reexamination Certificate

active

06858938

ABSTRACT:
A semiconductor device includes a substrate; an external electrode terminal for electrically connecting to an external electrode; a first semiconductor chip provided above the substrate, having a plurality of electrode pads disposed on a major surface thereof; a second semiconductor chip provided above the first semiconductor chip, having a plurality of electrode pads disposed on a major surface thereof; and connection lines for connecting the electrode pads to the external electrode. A part of the major surface of the first semiconductor chip faces a part of the surface opposite to the major surface of the second semiconductor chip; and the first semiconductor chip is shifted from the second semiconductor chip, so that the second semiconductor chip does not overlap the electrode pads of the first semiconductor chip.

REFERENCES:
patent: 5998864 (1999-12-01), Khandros et al.
patent: 6215182 (2001-04-01), Ozawa et al.
patent: 6252305 (2001-06-01), Lin et al.
patent: 6433421 (2002-08-01), Masuda et al.
patent: 6476474 (2002-11-01), Hung
patent: 6552437 (2003-04-01), Masuda et al.
patent: 6621155 (2003-09-01), Perino et al.
patent: P2000-315776 (2000-11-01), None
patent: P2002-43503 (2002-02-01), None

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