Interconnect substrate, semiconductor device, methods of...

Details Interconnect substrate, semiconductor device, methods of... Interconnect substrate, semiconductor device, methods of...

2005-03-15

2005-03-15

Zarabian, Amir (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S678000, C257S680000, C257S684000, C257S685000, C257S686000, C257S688000, C257S689000, C257S690000, C257S723000, C257S730000, C257S731000

Reexamination Certificate

active

06867496

ABSTRACT:
A semiconductor device including a substrate (10). An interconnect pattern (12) is formed over the substrate (10), and the substrate (10) has a first portion (14) and a second portion (16) to be superposed on the first portion (14). The first portion (14) has edges (22), (24), (26) and (28) as positioning references. The second portion (16) has a shape to be superposed over the first portion (14) except the edges (22), (24), (26) and (28).

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