Film with metal foil

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S247000, C156S307100, C156S345420

Reexamination Certificate

active

06866739

ABSTRACT:
In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.

REFERENCES:
patent: 4199646 (1980-04-01), Hori et al.
patent: 4522965 (1985-06-01), Waniczek et al.
patent: 5071914 (1991-12-01), Zimmel et al.
patent: 6143116 (2000-11-01), Hayashi et al.
patent: 6195882 (2001-03-01), Tsukamoto et al.
patent: 6197407 (2001-03-01), Andou et al.
patent: 6207272 (2001-03-01), Takahira et al.
patent: 11054865 (1999-02-01), None

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