Heat sink, fixing method thereof and electronic apparatus...

Details Heat sink, fixing method thereof and electronic apparatus... Heat sink, fixing method thereof and electronic apparatus...

2005-03-15

2005-03-15

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000, C257S719000, C361S719000

Reexamination Certificate

active

06867975

ABSTRACT:
Heat sink has fins on the top surface thereof and pin portions on the bottom surface thereof. Rivets having longitudinal through-hole are inserted into holes in a retention module. When the heat sink and the retention module are simultaneously pressed downward, the rivets are inserted into the corresponding holes formed in a base board. The pin portions are inserted into the through-holes of the rivets so that the retention module is locked onto the base board and the heat sink is fixed and the bottom surface of the heat sink is contacted with an integrated circuit element, at the same time.

REFERENCES:
patent: 4933746 (1990-06-01), King
patent: 6101091 (2000-08-01), Baik
patent: 6243265 (2001-06-01), Wong et al.
patent: 6327148 (2001-12-01), Tucker et al.
patent: 6392888 (2002-05-01), Chen et al.
patent: 6606246 (2003-08-01), Wells
patent: 2000-22089 (2000-01-01), None
patent: 2000-124650 (2000-04-01), None

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