Label to be attached on a plastic product formed in a mold...

Details Label to be attached on a plastic product formed in a mold... Label to be attached on a plastic product formed in a mold...

2005-10-25

2005-10-25

Frech, Karl D. (Department: 2876)

Registers

Records

Conductive

C235S472020, C235S375000, C235S487000, C340S572100, C340S572800

Reexamination Certificate

active

06957777

ABSTRACT:
A label to be attached on a plastic product formed in a mold and identifiable by a detecting device includes a soft circuit board, a protective layer and an adhesive layer. The soft circuit board has its outer surface provided with a radio frequency identifiable device (RFID). The protective layer is transparent, adhered on the outer surface of the soft circuit board for protecting and enabling RFID identified by a signal transmitted by a wireless detecting device. The adhering layer is made of a compound material and adhered on an inner layer for protecting the inner surface of the soft circuit board and the RFID as well. The label is attached on a plastic product during injecting molding process, widely usable for identifying an object affixed with the label by means of a detecting device.

REFERENCES:
patent: 4954814 (1990-09-01), Benge
patent: 5971437 (1999-10-01), Sakashita
patent: 5973599 (1999-10-01), Nicholson et al.
patent: 6100804 (2000-08-01), Brady et al.
patent: 6121880 (2000-09-01), Scott et al.
patent: 6163260 (2000-12-01), Conwell et al.
patent: 6206292 (2001-03-01), Robertz et al.
patent: 6255949 (2001-07-01), Nicholson et al.
patent: 6395373 (2002-05-01), Conti et al.
patent: 6509217 (2003-01-01), Reddy
patent: 6594370 (2003-07-01), Anderson
patent: 6657170 (2003-12-01), Clothier
patent: 6820314 (2004-11-01), Ferguson et al.
patent: 6836215 (2004-12-01), Laurash et al.
patent: 2003/0106204 (2003-06-01), Ferguson et al.
patent: 2004/0004131 (2004-01-01), Emmert
patent: 2004/0041262 (2004-03-01), Okamoto et al.
patent: 2004/0052034 (2004-03-01), Senba et al.
patent: 2004/0074974 (2004-04-01), Senba et al.
patent: 2004/0094949 (2004-05-01), Savagian et al.
patent: 2004/0100415 (2004-05-01), Veitch et al.
patent: 2004/0188531 (2004-09-01), Gengel et al.
patent: 2004/0217865 (2004-11-01), Turner
patent: 2004/0244865 (2004-12-01), Jung et al.
patent: 2005/0025943 (2005-02-01), Krappe et al.
http://www.m-source.com/EDS/atg023minfo.html.

Affiliated with

Also associated with

Rating

Label to be attached on a plastic product formed in a mold... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Label to be attached on a plastic product formed in a mold..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Label to be attached on a plastic product formed in a mold... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3451449