Stacked chip packaging

Details Stacked chip packaging Stacked chip packaging

2005-05-10

2005-05-10

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

Reexamination Certificate

active

06890798

ABSTRACT:
A multi-chip package and a method of manufacturing the same. The multi-chip package of the present invention has a plurality of shelves. A first semiconductor is electrically coupled to at least one of the package's shelves. A second semiconductor die is electrically coupled to at least one of the package's shelves, wherein the second semiconductor die is above said first semiconductor die.

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