Method for producing printed wiring board

Details Method for producing printed wiring board Method for producing printed wiring board

2005-09-13

2005-09-13

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S831000, C029S829000, C029S846000, C029S847000, C029S852000, C174S262000, C428S901000

Reexamination Certificate

active

06941648

ABSTRACT:
A method for making a printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate2, comprised of a core material11at least one side of which carries a land23, and flexible substrates3, 4, 5, and6comprised of core materials33, 36on at least one surface of which a bump32for electrical connection to the land38is formed protuberantly. The rigid substrate2and the flexible substrates3to6are molded as one with each other, with the interposition of an adhesive in-between, so that the land and the bump face each other.

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patent: 6839964 (2005-01-01), Henson

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