Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-05-24
2005-05-24
Nguyen, Tuan H. (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S108000, C438S612000
Reexamination Certificate
active
06897089
ABSTRACT:
A method for fabricating semiconductor components includes the steps of providing semiconductor dice on a substrate and forming a polymer layer on the substrate. In addition, the method includes the steps of providing a stencil having patterns thereon, and pressing the stencil into the polymer layer to form complimentary patterns in the polymer layer. The method also includes the steps of forming conductors in the polymer layer by forming a conductive layer on the complimentary patterns, and planarizing the conductive layer and the polymer layer to a same surface. A system for performing the method includes the substrate, the stencil and an energy source for curing the polymer layer. The system also includes an optical or mechanical alignment apparatus for aligning the stencil to the substrate.
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Gratton Stephen A.
Micro)n Technology, Inc.
Nguyen Tuan H.
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