Leads under chip IC package

Details Leads under chip IC package Leads under chip IC package

2005-10-25

2005-10-25

Chambliss, Alonzo (Department: 2827)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S692000, C257S773000, C257S784000, C257S787000, C438S123000, C361S772000, C361S812000, C029S827000

Reexamination Certificate

active

06958528

ABSTRACT:
A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of the lead frame located below the semiconductor device in a substantially horizontal plane and another portion of the plurality of lead fingers of the lead frame located substantially in the same horizontal plane as the active surface of the semiconductor device. Both pluralities of lead fingers of the lead frame having their ends being located substantially adjacent the peripheral sides of the semiconductor device, rather than at the ends thereof.

REFERENCES:
patent: 3444440 (1969-05-01), Bell et al.
patent: 3708730 (1973-01-01), Schlerz et al.
patent: 4048438 (1977-09-01), Zimmerman
patent: 4246595 (1981-01-01), Noyori et al.
patent: 4447857 (1984-05-01), Marks et al.
patent: 4595945 (1986-06-01), Graver
patent: 4612564 (1986-09-01), Moyer
patent: 4827328 (1989-05-01), Ozawa et al.
patent: 4934820 (1990-06-01), Takahashi et al.
patent: 4937656 (1990-06-01), Kohara
patent: 4943843 (1990-07-01), Okinaga et al.
patent: 5382546 (1995-01-01), Yamada et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 5445311 (1995-08-01), Trask et al.
patent: 5477079 (1995-12-01), Hiruta
patent: 5497030 (1996-03-01), Takeuchi
patent: 5497031 (1996-03-01), Kozono
patent: 5502278 (1996-03-01), Mabboux et al.
patent: 5504370 (1996-04-01), Lin et al.
patent: 5539251 (1996-07-01), Iverson et al.
patent: 5541446 (1996-07-01), Kierse
patent: 5550402 (1996-08-01), Nicklaus
patent: 5554886 (1996-09-01), Song
patent: 5557143 (1996-09-01), Seiji
patent: 5592019 (1997-01-01), Ueda et al.
patent: 5663594 (1997-09-01), Kimura
patent: 5763829 (1998-06-01), Tomita et al.
patent: 5776799 (1998-07-01), Song et al.
patent: 5780925 (1998-07-01), Cipolla et al.
patent: 5907769 (1999-05-01), Corisis
patent: 6130474 (2000-10-01), Corisis
patent: 6271580 (2001-08-01), Corisis
patent: 6277673 (2001-08-01), Corisis
patent: 6445061 (2002-09-01), Corisis
patent: 2-110961 (1990-04-01), None
patent: 3-6850 (1991-01-01), None
patent: 3-195052 (1991-08-01), None

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